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AM Compass Group Inc is a premier
manufacturer of the high performance thermal packaging solutions with
composition-tailored materials including W/Cu, Mo/Cu, Cu/Mo/Cu, Cu/Mo70Cu/Cu.
Through extensive R&D efforts, stringent manufacturing process, and strict
quality control system, we have become a leading supplier of substrate and
heatsink packages for semiconductor, optoelectronics, LED, aerospace, and
defense industries. We strive to provide our customer high quality products,
on-time delivery, outstanding customer services, and competitive pricing.
Customer satisfaction is our ultimate mission!
AMCG has successfully
developed a variety of heat sink materials with unique features such as a high
thermal conductivity, a low thermal expansion rate, and a low dielectric
constant. We design and manufacture a broad line of custom heatsinks for
microwave, laser housing, communication and other applications.
| Copper
Tungsten (Cu-W)
Features:
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CTE closely controlled to match ceramics(Al2O3, BeO),
semiconductor (Si), metals like Kovar, etc.
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High thermal conductivity
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Excellent hermeticity
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Excellent size, surface finish and
flatness control
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Semi-finished or finished (Ni/Au
plated) products available
Applications:
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RF, Microwave millimeter
wave packages: LDMOS FET; MSFET; HBT; Bipolar; HEMT; MMIC
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Light Emitting Diodes and
Detectors
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Laser Diode Packages:
Pulse, CW, Single Emitter, Bars
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Complex Carriers for
Optoelectronics Amplifiers, Receivers,
Transmitters, Tunable
Lasers
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Type
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Composition
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Properties
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Element
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Content,
wt-%
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Density
g/cm3
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CTE,
ppm/K
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Thermal
Conductivity,
W/m.K
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W90Cu
|
WCu
|
90±1
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17.0
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6.5
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180～190
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W85Cu
|
WCu
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85±1
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16.3
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7.0
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190～200
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W80Cu
|
WCu
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80±1
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15.4
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8.3
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200～210
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W75Cu
|
WCu
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75±1
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14.9
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9.0
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220～230
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Copper Molybdenum (Cu-Mo)
Features (more
for aeronautic and astronautic application
s):
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High thermal conductivity, no
sintering additives used
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Relatively lower density and lighter weight
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Excellent hermeticity through Nickel and gold plating
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Stampable sheets available (Mo
content less than 70wt-%)
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Semi-finished or finished (Ni/Au
plated) products available
Applications:
- RF, Microwave packages
- Optoelectronics Packages
- Power
Packages: Bases of Thrysisters and Rectifiers etc
- Core Layer of High-performance PCBS
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Type
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Composition
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Properties
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|
Element
|
Content,
wt-%
|
Density
g/cm3
|
CTE,
ppm/K
|
Thermal
Conductivity,
W/m.K
|
|
Mo70Cu
|
MoCu
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70±1
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9.8
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9.1
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170～200
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Mo60Cu
|
MoCu
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60±1
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9.66
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10.3
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210～250
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Mo50Cu
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MoCu
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50±1
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9.54
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11.5
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230～270
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Cu/Mo/Cu
(CMC)
Cu/Mo/Cu
(CMC) is a sandwich composite comprised of a molybdenum core layer and
two copper clad layers. It
has custom CTE, high thermal conductivity and high strength. All types
of Cu/Mo/Cu sheets can be stamped into components.
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Features:
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High thermal conductivity
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Large
sized sheets available (up to 400mmx 200mm)
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Can
be stamped into components
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Very
strong interface bonding which can repeatedly resist 850℃ heat shock
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Tailorable
CTE matching that of semiconductor and ceramic materials
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High
thermal conductivity
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No magnetism
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Cu/Mo/Cu
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Density
g/cm3
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CTE，
ppm/K
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Thermal
conductivity, W/m.K
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In-plane
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Thru-thickness
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1:4:1
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9.75
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6.0
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220
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125
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1:3:1
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9.66
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6.8
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244
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130
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1:2:1
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9.54
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7.8
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260
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142
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1:1:1
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9.32
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8.8
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305
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160
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Cu/Mo70Cu/Cu
(CPC)
Cu/Mo70/Cu (CPC) is a sandwich composite like
Cu/Mo/Cu, including a Mo70-Cu alloy core layer and two copper clad
layers. The ratio of the
thickness is 1:4:1. It has different CTE in X and Y direction, higher
thermal conductivity than that of WCu, MCu, or Cu/Mo/Cu, and costs less.
All types of Cu/Mo70Cu/Cu sheets can be stamped into components.
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Features:
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Higher thermal conductivity than Cu/Mo/Cu material
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Large sized
sheets available (up to 400mmx 200mm)
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Can be
stamped into components
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Very strong
interface bonding which can repeatedly resist 850℃ heat shock
-
Tailorable
CTE matching that of semiconductor and ceramic materials
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High
thermall conductivity
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No magnetism
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Cu/Mo70Cu/Cu
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Density
g/cm3
|
CTE，ppm/K
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Thermal
conductivity, W/m.K
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X-direction
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Y-direction
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In-plane
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Thru-thickness
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1:4:1
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9.46
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7.2
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9.0
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340
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300
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AM
COMPASS
GROUP,
INC.
