AM COMPASS GROUP, INC.

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Thermal Solutions

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AM Compass Group Inc is a premier manufacturer of the high performance thermal packaging solutions with composition-tailored materials including W/Cu, Mo/Cu, Cu/Mo/Cu, Cu/Mo70Cu/Cu. Through extensive R&D efforts, stringent manufacturing process, and strict quality control system, we have become a leading supplier of substrate and heatsink packages for semiconductor, optoelectronics, LED, aerospace, and defense industries. We strive to provide our customer high quality products, on-time delivery, outstanding customer services, and competitive pricing. Customer satisfaction is our ultimate mission!

AMCG has successfully developed a variety of heat sink materials with unique features such as a high thermal conductivity, a low thermal expansion rate, and a low dielectric constant. We design and manufacture a broad line of custom heatsinks for microwave, laser housing, communication and other applications.    

Copper Tungsten (Cu-W)

Features:

  • CTE closely controlled to match ceramics(Al2O3, BeO), semiconductor (Si), metals like Kovar, etc.  

  • High thermal conductivity

  • Excellent hermeticity

  • Excellent size, surface finish and flatness control

  • Semi-finished or finished (Ni/Au plated) products available

Applications:

  • RF, Microwave millimeter wave packages: LDMOS FET; MSFET; HBT; Bipolar; HEMT; MMIC

  • Light Emitting Diodes and Detectors

  • Laser Diode Packages: Pulse, CW, Single Emitter, Bars

  • Complex Carriers for Optoelectronics Amplifiers, Receivers,  Transmitters, Tunable Lasers

 

Type

Composition

Properties

Element

Content,
wt-%

Density
g/cm3

CTE,
ppm/K

Thermal Conductivity,
W/m.K

W90Cu

WCu

901

17.0

6.5

180190

W85Cu

WCu

851

16.3

7.0

190200

W80Cu

WCu

801

15.4

8.3

200210

W75Cu

WCu

751

14.9

9.0

220230

 

Copper Molybdenum (Cu-Mo)

Features (more for aeronautic and astronautic application s):

  • High thermal conductivity, no sintering additives used

  • Relatively lower density and lighter weight

  • Excellent hermeticity through Nickel and gold plating

  • Stampable sheets available (Mo content less than 70wt-%)

  • Semi-finished or finished (Ni/Au plated) products available

Applications:

  • RF, Microwave packages
  • Optoelectronics Packages
  • Power Packages: Bases of Thrysisters and Rectifiers etc
  • Core Layer of High-performance PCBS

Type

Composition

Properties

Element

Content,
wt-%

Density
g/cm3

CTE,
ppm/K

Thermal Conductivity,
W/m.K

Mo70Cu

MoCu

701

9.8

9.1

170200

Mo60Cu

MoCu

601

9.66

10.3

210250

Mo50Cu

MoCu

501

9.54

11.5

230270

 

Cu/Mo/Cu (CMC)  

  Cu/Mo/Cu (CMC) is a sandwich composite comprised of a molybdenum core layer and two copper clad layers.  It has custom CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.

 

Features:

  • High thermal conductivity

  • Large sized sheets available (up to 400mmx 200mm)

  • Can be stamped into components

  • Very strong interface bonding which can repeatedly resist 850℃ heat shock

  • Tailorable CTE matching that of semiconductor and ceramic materials

  • High thermal conductivity

  • No magnetism

Cu/Mo/Cu

Density
g/cm3

CTE
ppm/K

Thermal conductivity, W/m.K

In-plane

Thru-thickness

1:4:1

9.75

6.0

220

125

1:3:1

9.66

6.8

244

130

1:2:1

9.54

7.8

260

142

1:1:1

9.32

8.8

305

160

 

Cu/Mo70Cu/Cu (CPC)

Cu/Mo70/Cu (CPC) is a sandwich composite like Cu/Mo/Cu, including a Mo70-Cu alloy core layer and two copper clad layers.  The ratio of the thickness is 1:4:1. It has different CTE in X and Y direction, higher thermal conductivity than that of WCu, MCu, or Cu/Mo/Cu, and costs less. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.

Features:

  • Higher thermal conductivity than Cu/Mo/Cu material

  • Large sized sheets available (up to 400mmx 200mm)

  • Can be stamped into components

  • Very strong interface bonding which can repeatedly resist 850℃ heat shock

  • Tailorable CTE matching that of semiconductor and ceramic materials

  • High thermall conductivity

  • No magnetism  

Cu/Mo70Cu/Cu

Density
g/cm3

CTEppm/K

Thermal conductivity, W/m.K

X-direction

Y-direction

In-plane

Thru-thickness

1:4:1

9.46

7.2

9.0

340

300